Semicon Handling system

Memory T2B transfer system

Function	JEDEC tray to board
Target device	Memory device
Tray L/UL capacity	Hard tray 10ea
Module Lo & Unloading method	Automatic P&P (Corner grip)
Tray moving method	Automatic P&P
Buffer	Align buffer 3ea (loading, unloading)
Air Supply	5~6kg/㎤
Control PC	I7 Quad Core, 8G Byte Memory, Window 10 64bit
Power	AC220V, 50/60Hz 8.6KVA, 22.6A, 3Phase
Weight	2,000kg
Dimension	W1,395 x D2,928 x H2,240mm (without signal tower)