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Semicon Handling system

SEM vertical sample prep system

PK5002

SEM vertical sample prep system

FEATURES

  • SEM Vertical sample prep system
  • Function : SEM vertical sample preparation(Dicing, polishing etc.)
  • Target device : Sample wafer

SPECIFICATION

Function JEDEC tray to board
Target device Sample wafer
Dicing X-Axis Material size : 50 x 50mm / Cutting range : 40mm / Cutting speed : 0.01-400mm/sec
Y & θ-Axis Full Stroke : 250mm/sec / Index Speed Range : 0 ~ 300r/min / Resolution Setting : 1000P/R 0.036˚/Pulse / Min. Step : 0.1㎛
Z-Xis Max. stroke : 75mm / Min. Step : 0.1㎛
Spindle Speed range : to 40,000rpm / Power range : 2.4kw
Expanding Wafer Frame Size : 100 x 100mm / UV Tape Size : 100 x 100mm / EXP. Stoke : to 20mm
Grinding Size/Max speed : 150x38x20mm/1550rpm
Glass dressing Size : 9x11.5mm
Polishing Diamond Lapping Film Size : 5 inch / Substrates : Glass / Polishing Position : 2 Place
Control PC I7 Quad Core, 8G Byte Memory , Window 7 64bit
Power AC220V, 50/60Hz 20A, 4.4kW, 3 Phase
Weight App. 2000kg
Dimension W1700 x D1300 x H1900mm (main) / W400 x D780 x H1260mm(tape mounter)