Semicon handling system

Package laser marking system

Package laser marking system
Target device : Semiconductor package(Saw filter, WIFI module), Chip capacitor, Electrical part
Loading/unloading method : Tray magazine load, 20ea/a magazine, 2 magazines

Function	Laser marking
Target device	Semiconductor package(Saw filter, WIFI module), Chip capacitor, Electrical part
Marking area	250X250mm(changed depend on devices)
One-shot coverage	120x120x42mm (the minimum letter size – 0.1mm)
Laser resolution	2um
Temperature	Room, up to 150℃
Barcode reader	1D/2D barcode scanning
Vision	1 Top vision, 1 Bottom vision SXGA Mono color[RED & White lamp] Marking inspection, Position, Alignment
Loading/unloading method	Tray magazine load, 20ea/a magazine, 2 magazines
Control PC	I7 Quad Core, 16G Byte Memory , Window 10, 64bit
Power	AC220V, 50/60Hz 15A, 3.3 kW, 1 Phase
Weight	1100kg
Dimension	W2050 x D1000 x H1650mm